The Journal of the Korean Journal of Metals and Materials
Effect of Fe Content on T6 Aging Behavior and Mechanical Properties of Recycled Al-Mg-Si Alloys
Optimizing Constitutive Parameters to Improve Prediction of Hot Deformation Behavior of Titanium Alloy
Experimental Analysis and Theoretical Estimation to Address Filler-induced damage in Semiconductor Devices under Thermal Cycling Conditions
Tailoring the Morphology of MoS2/Graphene Heterostructures for Efficient Photoelectrochemical Applications
Development and Thermal Performance Analysis of CNT?Fiber Bi-layer Films via Flammable Sheet Lamination
An IDW-Based CFD?FEA Temperature Field Coupling Method to Predict Thermal Deformation in ADC12 High-Pressure Die Casting
Effect of ZnO on Ag Redox Reaction of Magnesium Phosphate Glasses
High Temperature Compressive Deformation Behavior of Laser Powder Bed Fusion AlSi10Mg Alloy under Different Heat Treatment Conditions
Recent Advances in Bumpless Hybrid Bonding for AI Semiconductor Packaging - Focusing on Passivation Layer, SAB, SiCN and Bonding Strength