The Journal of
the Korean Journal of Metals and Materials

The Journal of
the Korean Journal of Metals and Materials

Monthly
  • pISSN : 1738-8228
  • eISSN : 2288-8241

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2026-04

202604 (Vol.64, No.4)

P.267

Correlation between Microstructural Evolution and Impact Toughness of Ti-6Al-4V Alloy under Different Annealing Conditions Using Instrumented Charpy Impact Tests

황정우(Jung Woo Hwang) ; 양준하(Junha Yang) ; 김재호(Jae Ho Kim) ; 정영웅(Yeongwoong Jung) ; 염종택(Jong-Taek Yeom)
https://doi.org/10.3365/KJMM.2026.64.4.267
P.282

Use of Activated Carbon as a Copper Substitute during Cobalt Cementation for Zinc Electrolyte Purification

백다경(Dakyeong Baek) ; 임유진(Yoojin Lim) ; 유경근(Kyoungkeun Yoo) ; 이상훈(Sang-Hun Lee) ; Manis Kumar Jha(Manis Kumar Jha)
https://doi.org/10.3365/KJMM.2026.64.4.282
P.288

Tailoring the Morphology of WS2 for Efficient Multidisciplinary Applications

(Jin Kim) ; (Seungyoung Park)
https://doi.org/10.3365/KJMM.2026.64.4.288
P.294

Rapid Activation of Solution-Processed ZrOx Gate Dielectrics via Pulsed-UV Annealing for Pentacene OTFTs

(Hyeonju Lee) ; (Bokyung Kim) ; (Taehui Kim) ; (Dongwook Kim) ; (Xue Zhang) ; (Jin-Hyuk Bae) ; (Youngjun Yun) ; (Sungkeun Baang) ; (Jaehoon Park)
https://doi.org/10.3365/KJMM.2026.64.4.294
P.302

Analysis of Flow in an Electric Arc Furnace Water Model under Bottom-Blowing Conditions Using Numerical Simulation

양익준(Ik Jun Yang) ; 장병록(Byoung Lok Jang)
https://doi.org/10.3365/KJMM.2026.64.4.302
P.312

Gallium-Indium-Tin Alloy Properties and Treatment with Sulfuric Acid

(Bo Raadam) ; (Jaeheon Lee)
https://doi.org/10.3365/KJMM.2026.64.4.312
P.325

High-Performance Ag/Ag2Te-Integrated Sb2Te3 Thermoelectric Films via Two Step Plating

(Ji Hee Pi) ; (Yong Whan Kim) ; (Yan Gu) ; (Nosang Vincent Myung) ; (Kyu Hyoung Lee) ; (Jeong Yun Hwang)
https://doi.org/10.3365/KJMM.2026.64.4.325
P.331

A Comprehensive Review of Hydrogen Embrittlement Testing Methods and Standards for Steels

황병철(Byoungchul Hwang)
https://doi.org/10.3365/KJMM.2026.64.4.331
P.350

Chemical?Mechanical Polishing Challenges and Dishing Control in Hybrid Cu/SiO2 Bonding for Advanced 3D Packaging: A Review

이수(Su Lee) ; 김현식(Hyun-Sik Kim) ; 정도현(Do Hyun Jung) ; 정재필(Jae Pil Jung)
https://doi.org/10.3365/KJMM.2026.64.4.350