The Journal of
the Korean Journal of Metals and Materials

The Journal of
the Korean Journal of Metals and Materials

Monthly
  • pISSN : 1738-8228
  • eISSN : 2288-8241

Editorial Office

REFERENCES

1 
Hsiung C.-K., Chen K.-N., IEEE Nanotechnol. Mag., 18, 41 (2024)DOI
2 
Hsu M.-P., Chen C.-Y., Chang H.-C., Chen K.-N., J. Mater. Res. Technol., 36, 7748 (2025)Google Search
3 
Seo H., Park H., Kim S.-E., J. Microelectron. Packag. Soc., 27, 17 (2020)Google Search
4 
Ji H. M., Chui K.-J., Proc. IEEE 23rd Electron. Packag. Technol. Conf. (EPTC), 28, IEEE (2021)Google Search
5 
Li Y., Ruan M., Liu L., Chen Z., Proc. 24th Int. Conf. Electron. Packag. Technol. (ICEPT), IEEE (2023)Google Search
6 
Le X.-B., Choa S.-H., Micromachines, 15, 1332 (2024)DOI
7 
Lee J.-Y., Tukhtaev A., Yoo S., Kim Y.-H., Choi S.-G., Ryu H. G., Jeong Y. J., Kim S.-J., Korean J. Met. Mater., 60, 557 (2022)Google Search
8 
Park T. W., Byun M., Jung H., Park W. I., Korean J. Met. Mater., 58, 26 (2020)DOI
9 
Roh M.-H., Sharma A., Lee J.-H., Jung J.-P., Metall. Mater. Trans. A, 46, 2051 (2015)DOI
10 
Vlassak J. J., Proc. MRS Symp. 671, M4.6.1, Materials Research Society (2001)Google Search
11 
Liu Y., Xiao K., Zhang K., Zhang J., Liu D., Proc. 25th Int. Conf. Electron. Packag. Technol. (ICEPT), IEEE (2024)Google Search
12 
Park A., Hwang H.-I., Jo I.-H., Lee S.-H., Ha J., Choi M.-J., Kim J. H., Korean J. Met. Mater., 63, 735 (2025)Google Search
13 
Nguyen V., VanKranenburg H., Woerlee P., Microelectron. Eng., 50, 403 (2000)DOI
14 
Zhao J., Wang F., Xu Y., Tan B., Zhao X., Zhang S., Han X., Li R., Colloids Surf. A, 703, 135351 (2024)DOI
15 
Ming Z., Wei W., Hongbo S., Guilei W., Chao Z., Proc. 2025 Conf. Sci. Technol. Integr. Circuits (CSTIC), IEEE (2025)Google Search
16 
Cho D. H., Seo S. M., Kim J. B., Rajendran S. H., Jung J. P., Metals, 11, 1664 (2021)Google Search
17 
Roshanghias A., Kaczynski J., Rodrigues A., Karami R., Pires M., Burggraf J., Schmidt A., ECS J. Solid State Sci. Technol., 12, 084001 (2023)DOI
18 
Lee S.-M., Kim Y.-W., Korean J. Met. Mater., 61, 76 (2023)DOI
19 
Kitagawa H., Sato R., Ebiko S., Nagata A., Ahn C., Kim Y., Kang J., Uedono A., Inoue F., ACS Omega, 10, 27575 (2025)DOI
20 
Cho Y.-R., Lee D.-H., Mun S.-Y., Kim M. J., Korean J. Met. Mater., 63, 1012 (2025)DOI
21 
Nakayama K., Hayama K., Tanaka F. L., La M. T. N., Inoue F., ECS J. Solid State Sci. Technol., 13, 074009 (2024)DOI
22 
Lee R.-J., He P.-S., Tran D.-P., Chiu W.-L., Chang H.-H., Lee C.-C., Chen C., Appl. Surf. Sci., 684, 161832 (2025)DOI
23 
Ma K., Bekiaris N., Hsu C.-H., Xue L., Ramaswami S., Ding T., Probst G., Wernicke T., Uhrmann T., Wimplinger M., Proc. IEEE 74th Electron. Compon. Technol. Conf. (ECTC), 331, IEEE (2024)Google Search
24 
Hahn S. H., Kim W., Shin D., Lee Y., Kim S., Choi W., Lim K., Moon B., Rhee M., Proc. IEEE 73rd Electron. Compon. Technol. Conf. (ECTC), 1390, IEEE (2023)Google Search
25 
Jo H., Lee D. S., Jeong S. H., Lee H. S., Jeong H. D., Appl. Sci., 11, 2217 (2021)Google Search
26 
Kim E., Choi S., Jeon S., Seok H., Cho J.-i., Shin D., Kim T., Mater. Sci. Semicond. Process., 152, 107025 (2022)DOI
27 
Zheng A.-J., Li C.-C., J. Magn. Magn. Mater., 616, 172803 (2025)DOI
28 
Yang C., Niu X., Zhou J., Wang J., Huo Z., Lu Y., ECS J. Solid State Sci. Technol., 9, 034010 (2020)DOI
29 
Hu L., Pan G., Li C., Zhang X., Liu J., He P., Wang C., Mater. Sci. Semicond. Process., 108, 104883 (2020)DOI
30 
Hong S., Han D., Kwon J., Kim S. J., Lee S. J., Jang K.-S., Microelectron. Eng., 232, 111417 (2020)DOI
31 
Mariappan M., Hashimoto H., Mihara K., Hare T., Fukushima T., Inoue F., Uedono A., Proc. 2024 Int. 3D Syst. Integr. Conf. (3DIC), IEEE (2024)Google Search
32 
Park S., Kang S., Kim D. G., Kim S., CIRP Ann., 74, 465 (2025)DOI
33 
Khurana G., Panchenko I., Proc. IEEE 25th Electron. Packag. Technol. Conf. (EPTC), 373, IEEE (2023)Google Search
34 
Zienert A., Langer J., Hensel D., Hofmann L., Gottfried K., Schuster J., Proc. IEEE Int. Interconnect Technol. Conf. (IITC) and IEEE Mater. Adv. Metall. Conf. (MAM), IEEE (2023)Google Search
35 
Choi J., Jang S., Lee D., Kang S., Kim S., Kim S. E., J. Semicond. Technol. Sci., 25, 102 (2025)Google Search
36 
Jeong S., Shin Y., Jeong J., Jeong S., Jeong H., J. Korean Soc. Precis. Eng., 41, 467 (2024)Google Search
37 
Jhong C., Tsai Y.-H., Lu L.-S., Chen C., Huy L. N. Q., Chen C.-C. A., Proc. Int. Conf. Planarization/CMP Technol., HAL (2023)Google Search
38 
Kim Y., Yoon S., Han H., Seo J., Park J., Yoo B., Proc. IEEE Int. Interconnect Technol. Conf. (IITC) and IEEE Mater. Adv. Metall. Conf. (MAM), IEEE (2023)Google Search
39 
Park S., Kang S., Kim D. G., Kim S., Proc. 2024 KSME Acad. Conf., 2223 (2024)Google Search
40 
Roy S. C., Guan C. G., Venkataraman N., Lee W., Singh N., Proc. IEEE 25th Electron. Packag. Technol. Conf. (EPTC), 135, IEEE (2023)Google Search
41 
Chidambaram V., Lianto P., Wang X., See G., Wiswell N., Kawano M., Proc. IEEE 71st Electron. Compon. Technol. Conf. (ECTC), 426, IEEE (2021)Google Search
42 
Ma K., Bekiaris N., Ramaswami S., Ding T., Probst G., Burggraf J., Uhrmann T., Proc. IEEE 73rd Electron. Compon. Technol. Conf. (ECTC), 1110, IEEE (2023)Google Search
43 
Dubey V., Wünsch D., Gottfried K., Wiemer M., Fischer T., Schermer S., Dittmar N., Helke C., Haase M., Ghosal S., Hanisch A., Bonitz J., Luo-Hofmann J., Hofmann L., Lykova M., Stoll F., Vogel K., Schulz S. E., Proc. IEEE 73rd Electron. Compon. Technol. Conf. (ECTC), 795, IEEE (2023)Google Search
44 
Ji H.-M., Lee C., Tee S. F., Dickson W. J. T., Irving G. O. T., Venkataraman N., Lianto P., Tan A., Lie J., Sum D., Seow K., Cheok K., Chong H. J., Tamboli D., Teo M., Proc. IEEE 26th Electron. Packag. Technol. Conf. (EPTC), 194, IEEE (2024)Google Search
45 
Pal A., Thareja G., Dag S., Costrini G., Reddy V., Xu Y., Lei Y., Zhang A., Shen G., Jansen A., Chen Z., Gage M., Tang J., Yang Y.-C., Deshpande S., Huey S., Hung R., Jiang H., Cai M.-P., Abramovitz Y., Engel L., Naik M., Wang R., Kesapragada S., Ayyagari-Sangamalli B., Tang X., Bazizi E. M., Proc. Int. Electron Devices Meet. (IEDM), 294, IEEE (2022)Google Search
46 
Jung E. S., Pyo S. G., J. Surf. Sci. Eng., 57, 140 (2024)Google Search
47 
Yu H.-M., Lin C.-C., Hsu M.-H., Chen Y.-T., Chen K.-W., Luoh T., Yang L.-W., Yang T., Chen K.-C., IEEE Trans. Semicond. Manuf., 34, 280 (2020)Google Search
48 
Cui Z., Zhao H., Liu Y., Wang C., Proc. China Semicond. Technol. Int. Conf. (CSTIC), IEEE (2021)Google Search
49 
Reff C. M., Gamagedara K. U., Santefort D. R., Roy D., Lubricants, 13, 301 (2025)DOI
50 
Yang Y., Zhao W., Xiao R., Li H., Zhang J., Zhou H., Fang J., Zhang Y., Proc. China Semicond. Technol. Int. Conf. (CSTIC), IEEE (2022)Google Search
51 
Yao Y., Yang C., Tan E., Proc. China Semicond. Technol. Int. Conf. (CSTIC), IEEE (2023)Google Search
52 
Yun S.-S., Son Y.-H., Jeong G.-p., Lee J.-h., Jeong J.-h., Bae J.-Y., Kim S.-I., Park J.-H., Park J.-G., Colloids Surf. A, 616, 126143 (2021)DOI
53 
Kang H. S., Lee J. H., Park J. H., Lee H. A., Park W. I., Kang S. M., Yi S. C., Korean J. Met. Mater., 57, 582 (2019)DOI
54 
Inoue F., Peng L., Iacovo S., Phommahaxay A., Visker J., Verdonck P., Meersschaut J., Dara P., Sleeckx E., Miller A., ECS Trans., 86, 159 (2018)Google Search