| Title |
Recent Advances in Bumpless Hybrid Bonding for AI Semiconductor Packaging - Focusing on Passivation Layer, SAB, SiCN and Bonding Strength |
| Authors |
선신희(Shin Hui Seon) ; 임채연(Chae Yeon Lim) ; 김현식(Hyun Sik Kim) ; 정재필(Jae Pil Jung) |
| DOI |
https://doi.org/10.3365/KJMM.2026.64.3.253 |
| ISSN |
1738-8228(ISSN), 2288-8241(eISSN) |
| Keywords |
AI semiconductor; Bumpless hybrid bonding; Copper bonding; TSV; Packaging |
| Abstract |
This review focuses on TSV-based bumpless hybrid bonding for AI semiconductors, covering metal passivation layers (Pt, Au, Ag, etc.) and surface activation techniques. |