| Title |
Experimental Analysis and Theoretical Estimation to Address Filler-induced damage in Semiconductor Devices under Thermal Cycling Conditions |
| Authors |
이성민(Seong-Min Lee) ; 연경열(Kyung-Yol Yon) |
| DOI |
https://doi.org/10.3365/KJMM.2026.64.3.196 |
| ISSN |
1738-8228(ISSN), 2288-8241(eISSN) |
| Keywords |
Semiconductor packaging; Epoxy molding compound; Filler; Thermal cycling; Damage |
| Abstract |
Experimental work shows how filler-induced pattern damage occurs in semiconductor devices under different thermal-cycling conditions (-55 to 170 °C) and provides theoretical analysis. |