The Journal of
the Korean Journal of Metals and Materials

Monthly
  • pISSN : 1738-8228
  • eISSN : 2288-8241

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Current Issue : Vol.64, No.3,

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Fe 함량이 재활용 Al-Mg-Si 합금의 T6 시효 거동 및 기계적 특성에 미치는 영향 Effect of Fe Content on T6 Aging Behavior and Mechanical Properties of Recycled Al-Mg-Si Alloys

https://doi.org/10.3365/KJMM.2026.64.3.177

이재석(Jae-Seok Lee) ; 이윤수(Yun-Soo Lee) ; 안지혁(Jee Hyuk Ahn) ; 김형준(Hyeong jun Kim) ; 윤연희(Yeon-hee Yoon) ; 손현우(Hyeon-Woo Son)

Heat-treatable Al-Mg-Si (6000 series) alloys are widely used in the transportation industry. This study investigates the effect of Fe content on the aging behavior and mechanical properties of recycled Al-Mg-Si alloys.

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구성방정식 매개변수 최적화를 통한 타이타늄 합금의 고온 변형 거동 예측 정확도 향상 Optimizing Constitutive Parameters to Improve Prediction of Hot Deformation Behavior of Titanium Alloy

https://doi.org/10.3365/KJMM.2026.64.3.187

이성호(Seong Ho Lee) ; 김상훈(Sang-Hoon Kim) ; 이종수(Chong Soo Lee) ; 이태경(Taekyung Lee)

This study introduces an optimum framework for the Zener?Hollomon constitutive model to accurately predict the hot deformation behavior of Grade 4 titanium alloy under various temperatures and strain rates.

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온도 싸이클링 환경에서 반도체 패키징용 에폭시 필러에 의한 기계적 손상의 원인을 규명하기 위한 실험적 평가와 이론적 분석 Experimental Analysis and Theoretical Estimation to Address Filler-induced damage in Semiconductor Devices under Thermal Cycling Conditions

https://doi.org/10.3365/KJMM.2026.64.3.196

이성민(Seong-Min Lee) ; 연경열(Kyung-Yol Yon)

Experimental work shows how filler-induced pattern damage occurs in semiconductor devices under different thermal-cycling conditions (-55 to 170 °C) and provides theoretical analysis.

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Tailoring the Morphology of MoS2/Graphene Heterostructures for Efficient Photoelectrochemical Applications

https://doi.org/10.3365/KJMM.2026.64.3.204

(Dong-Bum Seo) ; (Eui-Tae Kim)

Strategies to fabricate and optimize heterostructures of vertically aligned nanosheets are discussed. MoS2/graphene heterostructures exhibited significantly improved PEC performance due to synergistic effects.

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연소 제거 필름 기반 적층 공정을 이용한 CNT-섬유 이중층 필름 개발 및 발열 성능 분석 Development and Thermal Performance Analysis of CNT?Fiber Bi-layer Films via Flammable Sheet Lamination

https://doi.org/10.3365/KJMM.2026.64.3.211

김현우(Hyunwoo Kim) ; 이동관(Dong-Kwan Lee) ; 박성훈(Sung-Hoon Park)

Carbon nanotube (CNT) sheets are developed using a novel lamination process. The study focuses on mechanical reinforcement and thermal performance analysis for planar heaters.

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ADC12 고압 다이캐스팅 공정의 열변형 예측을 위한 IDW 기반 CFD?FEA 온도장 연계 해석 기법 연구 An IDW-Based CFD?FEA Temperature Field Coupling Method to Predict Thermal Deformation in ADC12 High-Pressure Die Casting

https://doi.org/10.3365/KJMM.2026.64.3.219

민창원(ChangWon Min) ; 장병록(ByoungLok Jang)

An IDW-based temperature field mapping method is proposed to predict thermal deformation by coupling CFD-based casting simulation with structural finite element analysis (FEA).

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Effect of ZnO on Ag Redox Reaction of Magnesium Phosphate Glasses

https://doi.org/10.3365/KJMM.2026.64.3.229

(Jeongho Cho) ; (Bongki Ryu) ; (Jaeyeop Chung)

Investigates how ZnO substitution for P2O5 alters structure-redox-property relationships. Optical measurements revealed absorbance near 415 nm due to Ag reduction.

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High Temperature Compressive Deformation Behavior of Laser Powder Bed Fusion AlSi10Mg Alloy under Different Heat Treatment Conditions

https://doi.org/10.3365/KJMM.2026.64.3.237

(R Kreethi) ; (So-Yeon Park) ; (Soobin Kim)

High-temperature compressive deformation behavior of L-PBF AlSi10Mg alloys was investigated at 150-250 °C under T6 and direct aging (DA) conditions.

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AI 반도체 패키징을 위한 bumpless 하이브리드 본딩의 최근 동향 - 부동태막, SAB법, SiCN 및 접합 강도를 중심으로 Recent Advances in Bumpless Hybrid Bonding for AI Semiconductor Packaging - Focusing on Passivation Layer, SAB, SiCN and Bonding Strength

https://doi.org/10.3365/KJMM.2026.64.3.253

선신희(Shin Hui Seon) ; 임채연(Chae Yeon Lim) ; 김현식(Hyun Sik Kim) ; 정재필(Jae Pil Jung)

This review focuses on TSV-based bumpless hybrid bonding for AI semiconductors, covering metal passivation layers (Pt, Au, Ag, etc.) and surface activation techniques.

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