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Utilizing Dip-Coating to Fabricate Gate Dielectric and Semiconductor for Thin-Film Transistors
딥코팅 방법을 활용한 게이트 산화물 유전체 및 반도체 박막의 제조 및 박막트랜지스터 응용
Yongwan Kim, Young-Geun Ha
김용완, 하영근
Korean J. Met. Mater. 2023;61(8):581-588.   Published online 2023 Jul 20
DOI: https://doi.org/10.3365/KJMM.2023.61.8.581

Abstract
The potential applications of advanced electronic materials in large-area, printable, and flexible electronics have generated significant interest. However, creating high-performance, low-voltage thin-film transistors (TFTs) for these applications remains difficult due to a lack of advanced gate dielectric and semiconductor materials that meet both ease-of-fabrication requirements and high electrical performance. In..... More

                
Thermal-Cycling-Induced Si<sub>3</sub>N<sub>4</sub> Damage in Semiconductor Devices Assembled Utilizing a Lead-on-Chip Package
리드-온-칩 패키지 기술로 조립된 반도체 디바이스에서 온도변화에 의해 발생되는 Si3N4 손상
Seong-Min Lee, Yeon-Wook Kim
이성민, 김연욱
Korean J. Met. Mater. 2023;61(2):76-83.   Published online 2023 Jan 27
DOI: https://doi.org/10.3365/KJMM.2023.61.2.76

Abstract
This article shows how fractures in the Si3N4 layer, which comprises the top layer of semiconductor devices encapsulated utilizing a lead-on-chip (LOC) packaging technique, are influenced by changes in the lead-frame materials and thermal-cycling test conditions. Using thermal-cycling tests, it was found that fractures in the Si 3 N 4..... More

                
Enhanced Photoelectrochemical Water-Splitting through Application of Layer by Layer (LBL) and Hydrothermal (HT) Methods in TiO<sub>2</sub> and -Fe<sub>2</sub>O<sub>3</sub> Hierarchical Structures
Aryan Azad, Sun Jae Kim
Korean J. Met. Mater. 2022;60(7):517-522.   Published online 2022 Jun 3
DOI: https://doi.org/10.3365/KJMM.2022.60.7.517

Abstract
Improving solar energy conversion efficiency and reducing energy loss have become critical issues in recent decades. Photoelectrochemical (PEC) water splitting provides an ideal method for solar energy harvesting and is a key factor in decreasing the use of fossil fuels. Thus, it is extremely important to identify cost-effective, highly active,..... More

                   Web of Science 3  Crossref 2
Effects of Blended Poly(3-hexylthiophene) and 6,13-bis(triisopropylsilylethynyl) pentacene Organic Semiconductors on the Photoresponse Characteristics of Thin-Film Transistors
Hyunji Shin, Hyeonju Lee, Bokyung Kim, Xue Zhang, Jin-Hyuk Bae, Jaehoon Park
Korean J. Met. Mater. 2022;60(3):198-205.   Published online 2022 Feb 8
DOI: https://doi.org/10.3365/KJMM.2022.60.3.198

Abstract
In this study, we demonstrate high-performance optical wavelength-selective organic thin-film transistors (TFTs) that incorporate heterogeneous organic semiconductor materials, poly(3-hexylthiophene) (P3HT) and 6,13-bis(triisopropylsilylethynyl) pentacene (TIPS-pentacene). The electrical characteristics of the fabricated transistors were analyzed in the dark to determine how the P3HT:TIPS-pentacene ratio of the semiconductor affected the performance of the..... More

                   Web of Science 3  Crossref 3
Improving the Corrosion Resistance of AISI 316L Steel for Semiconductor Piping by Controlled Delta-Ferrite Content
Young Woo Seo, Chan Yang Kim, Bo Kyung Seo, Won Sub Chung
Korean J. Met. Mater. 2022;60(1):46-52.   Published online 2021 Dec 10
DOI: https://doi.org/10.3365/KJMM.2022.60.1.46

Abstract
This study evaluated changes in delta-ferrite content depending on the preheating of AISI 316L stainless steel. We also determined the reasons for the variation in delta-ferrite content, which affects corrosion resistance. Changes in delta-ferrite content after preheating was confirmed using a Feritscope, and the microstructure was analyzed using optical microscopy..... More

                   Web of Science 3  Crossref 3
Low-Temperature H<sub>2</sub>S Sensors Based on Si-Coated SnO<sub>2</sub> Nanowires
Myung Sik Choi, Ali Mirzaei, Jae Hoon Bang, Han Gil Na, Changhyun Jin, Wansik Oum, Seungmin Han, Sang Sub Kim, Hyoun Woo Kim
Korean J. Met. Mater. 2019;57(11):732-740.   Published online 2019 Nov 5
DOI: https://doi.org/10.3365/KJMM.2019.57.11.732

Abstract
To attain high life standards, it is important to develop high-performance non-toxic gas sensors for public safety, environmental pollutant control, industrial processes, etc. Because reports on single element semiconductor-coated semiconducting metal oxides for sensing applications are rare, we synthesized SnO2 nanowires and coated them with a 5 nm-thick or 10..... More

                   Crossref 5
Cleavage Dicing Mechanics in Silicon Wafers
실리콘 웨이퍼의 그리비지 다이싱 역학
Seong-Min Lee, Yeon-Wook Kim
이성민, 김연욱
Korean J. Met. Mater. 2019;57(11):689-694.   Published online 2019 Nov 5
DOI: https://doi.org/10.3365/KJMM.2019.57.11.689

Abstract
This article details how effectively dicing damage of silicon wafers can be mechanically minimized by appropriate laser-induced groove formation prior to wafer separation. Various laser dicing factors, such as the laser-control power, the scan rate and the scan number of the laser beam, were estimated to determine the optimum groove..... More

                   Web of Science 2  Crossref 1
Influence of the Thickness of TiO<sub>2</sub>/TiO<sub>2-x</sub> Layers on the Behavior of a Memristor Device
TiO2/TiO2-x 박막층의 두께가 멤리스터 소자의 특성에 미치는 영향
Han-Sang Kim, Sung-Jin Kim
김한상, 김성진
Korean J. Met. Mater. 2019;57(2):84-90.   Published online 2019 Feb 5
DOI: https://doi.org/10.3365/KJMM.2019.57.2.84

Abstract
Memristors have been extensively investigated as the fourth fundamental circuit element. Titanium oxide is a common material used to fabricate memristors. In this paper, we investigated the influence of the thickness of the oxide active layer on the Al/TiO2-x/TiO2/heavily doped electrode memristor architecture. An insulating TiO2 thin-film was deposited using..... More

                   Web of Science 4  Crossref 5
Study of Novel EUV AbsorberNickel & Nickel Oxide
새로운 EUV 흡수체 연구:니켈 & 니켈 산화물
Dong Gon Woo, Jung Hwan Kim, Jung Sik Kim, Seongchul Hong, Jinho Ahn
우동곤, 김정환, 김정식, 홍성철, 안진호
Korean J. Met. Mater. 2017;55(3):198-201.   Published online 2017 Mar 3
DOI: https://doi.org/10.3365/KJMM.2017.55.3.198
Abstract
The shadowing effect is one of the most urgent issues yet to be solved in high-volume manufacturing using extreme ultraviolet lithography (EUVL). Many studies have been conducted to mitigate the unexpected results caused by shadowing effects. The simplest way to mitigate the shadowing effect is to reduce the thickness of... More
       Crossref 1
Electronic Materials
Effect of Sawing Velocity Variation on Chipping Damage of Semiconductor Wafers with Different Thicknesses
다이싱 속도 변화가 두께가 차별화된 반도체 웨이퍼의 칩핑 손상에 미치는 영향
Seong-Min Lee
이성민
Korean J. Met. Mater. 2016;54(8):598-604.   Published online 2016 Aug 5
DOI: https://doi.org/10.3365/KJMM.2016.54.8.598

Abstract
This work details how the sawing velocity influences the chipping damage of semiconductor wafers with different thicknesses during wafer separation. The experimental result shows that at a sawing velocity higher than 60000 rpm, in thinner wafers the magnitude of chipping damage more strongly depends on the revolving velocity of the..... More

       Crossref 3
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