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Cleavage Dicing Mechanics in Silicon Wafers
Seong-Min Lee, Yeon-Wook Kim
Korean J. Met. Mater.. 2019;57(11):689-694. Published online 2019 Nov 5 DOI: https://doi.org/10.3365/KJMM.2019.57.11.689
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Citations to this article as recorded by
 Mechanism for mitigating filler-induced reliability degradation in semiconductor devices assembled utilizing an LOC package technique
Seong-Min Lee, Yeon-Wook Kim
Journal of Mechanical Science and Technology.2020; 34(2): 675. CrossRef
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