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A Study on the Interrelationship between the Microstructural Features and the Elevated Temperature Strength of Multicomponent Al-Si-Cu-Ni Casting Alloys
다성분계 Al-Si-Cu-Ni 합금의 미세조직적 인자와 고온강도의 상관관계에 대한 연구
Min-Su Jo, Young-Hee Cho, Jung-Moo Lee, Soo-Bae Kim, Su-Hyeon Kim, Jae-il Jang
조민수, 조영희, 이정무, 김수배, 김수현, 장재일
Korean J. Met. Mater. 2022;60(7):489-501.   Published online 2022 Jun 3
DOI: https://doi.org/10.3365/KJMM.2022.60.7.489

Abstract
The elevated temperature strength of multicomponent Al-Si alloys is greatly affected by the volume fraction and the interconnectivity of hard phases formed upon solidification. In the present investigation, such influences were examined for two Al-Si-Cu-Ni alloys with different total volume fractions of hard phases. To control the microstructural features related..... More

                   Web of Science 2  Crossref 2
Thermal Conductivity of Three-Dimensionally Interconnected Graphene-Networked Cu Composite Fabricated by a Simple Two-Step Process
Xue Li, Terry Arthur Ring, Byung-Sang Choi
Korean J. Met. Mater. 2019;57(8):529-534.   Published online 2019 Jul 11
DOI: https://doi.org/10.3365/KJMM.2019.57.8.529

Abstract
A Cu composite reinforced by a three-dimensionally interconnected graphene network was synthesized in situ by a simple two-step process utilizing compacted Cu powder (99% purity) as a template for the growth of graphene. Cu composites with different graphene contents were obtained by controlling the processing parameters. The composites were approximated..... More

                   Web of Science 6  Crossref 6
Potential of Ruthenium and Cobalt as Next-generation Semiconductor Interconnects
Ru와 Co의 차세대 반도체 배선 적용성 연구
Dooho Choi
최두호
Korean J. Met. Mater. 2018;56(8):605-610.   Published online 2018 Aug 5
DOI: https://doi.org/10.3365/KJMM.2018.56.8.605

Abstract
Severe resistivity size effect in Cu interconnects is attributed to the relatively long bulk electron mean free path (39 nm at 298 K), which is inherently determined by phonon scattering. In this regard, Ru and Co have been recently considered as attractive alternatives for next-generation interconnect materials because the significantly..... More

                   Crossref 6
Pulsed Electrodeposition of Thin Cobalt Coating Layer on Ferritic Stainless Steel for SOFC Interconnects
Suk-Chul Kwak, Byung Kyu Kim, Dong-Ik Kim, Young Whan Cho
Korean J. Met. Mater. 2017;55(11):768-776.   Published online 2017 Oct 31
DOI: https://doi.org/10.3365/KJMM.2017.55.11.768

Abstract
A thin, compact, and uniform cobalt layer was coated on ferritic stainless steel (Crofer 22 APU) by high frequency square pulsed electrodeposition in an aqueous solution containing cobalt chloride and boric acid. The effects of various electrodeposition parameters and post heat treatment on the morphology, thickness, roughness and adhesion of..... More

    
Influence of Ultrasonic Melt Treatment and Cooling Rates on the Microstructural Development and Elevated Temperature Mechanical Properties of a Hypereutectic Al-18Si-4Cu-3Ni Piston Alloy
초음파 용탕 처리 및 냉각속도가 Al-18Si-4Cu-3Ni 피스톤용 합금의 미세조직과 고온인장특성에 미치는 영향
Jea-Hee Yoon, Young-Hee Cho, Jae-Gil Jung, Jung-Moo Lee, Ik Min Park
윤재희, 조영희, 정재길, 이정무, 박익민
Korean J. Met. Mater. 2017;55(6):396-404.   Published online 2017 Jun 1
DOI: https://doi.org/10.3365/KJMM.2017.55.6.396

Abstract
The influence of ultrasonic melt treatment (UST) combined with a change in cooling rates on the microstructure and elevated temperature mechanical properties of a hypereutectic Al-18Si-4Cu-3Ni piston alloy was investigated. Microstructural observation confirmed that UST effectively refined the sizes of primary Si and intermetallic compounds (e.g. ε-Al3Ni) while promoting their..... More

       Crossref 2
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