Korean J. Met. Mater. 2017;55(7):523-528. Published online 2017 Jul 4
DOI:
https://doi.org/10.3365/KJMM.2017.55.7.523
Abstract
Heat transfer plays a critical role in the fabrication of high efficiency electronic devices. Double-layer clad metals consisting of stainless steel (STS) and aluminum (Al) alloy were fabricated by the roll bonding process, and their thermal conductivity was calculated using measurements of density, specific heat, and thermal diffusivity obtained by.....
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