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A Review of Recent Research Trends of Forming of Metallic Bondlines Using Core-Shell Particles and Bonding Properties According to Particle Type
코어-쉘 입자를 사용한 금속 접합부 형성의 최근 연구 동향과 입자 종류에 따른 접합 특성 리뷰
Byeong Jo Han, Yeongjung Kim, Jong-Hyun Lee
한병조, 김영중, 이종현
Korean J. Met. Mater. 2023;61(9):679-693.   Published online 2023 Aug 30
DOI: https://doi.org/10.3365/KJMM.2023.61.9.679

Abstract
With the increasing numbers of electric vehicles and the prevalence of high heat generating devices, recent studies have attempted to address the limitations of conventional solder materials, including their low durability at temperatures exceeding 200 ℃, insufficient mechanical properties in a joint, and low thermal conductivity. Transient liquid-phase (TLP) partial..... More

                   Web of Science 4  Crossref 4
All-Solution-Processed OLEDs Using Printed Ag Electrodes and a PEI Bonding Layer
은 인쇄 전극과 PEI 접착 층을 사용한 용액공정 OLED
Cheol-Hee Moon
문철희
Korean J. Met. Mater. 2023;61(3):175-182.   Published online 2023 Feb 24
DOI: https://doi.org/10.3365/KJMM.2023.61.3.175

Abstract
We demonstrated a bonding technology using polyethyleneimine (PEI) as a bonding layer between printed Ag electrodes and an emission material layer (EML) to fabricate all-solution-processed Organic LightEmitting Diodes (OLEDs). We manufactured Ag electrodes on a glass substrate by the screen printing method, which was bonded to another substrate with ITO..... More

                   Web of Science 2  Crossref 1
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