Abstract
With the increasing numbers of electric vehicles and the prevalence of high heat generating devices, recent studies have attempted to address the limitations of conventional solder materials, including their low durability at temperatures exceeding 200 ℃, insufficient mechanical properties in a joint, and low thermal conductivity. Transient liquid-phase (TLP) partial..... More

Abstract
We demonstrated a bonding technology using polyethyleneimine (PEI) as a bonding layer between printed Ag electrodes and an emission material layer (EML) to fabricate all-solution-processed Organic LightEmitting Diodes (OLEDs). We manufactured Ag electrodes on a glass substrate by the screen printing method, which was bonded to another substrate with ITO..... More