Abstract
We demonstrated a bonding technology using polyethyleneimine (PEI) as a bonding layer between printed Ag electrodes and an emission material layer (EML) to fabricate all-solution-processed Organic LightEmitting Diodes (OLEDs). We manufactured Ag electrodes on a glass substrate by the screen printing method, which was bonded to another substrate with ITO..... More

Abstract
Cu-Pb and Cu-Sb alloys were prepared at various ratios, from 10:90 to 90:10, and leaching tests with sulfuric acid were conducted to investigate the effect of Pb and Sb on the leaching of Cu from speiss, which is obtained from the top submerged lance furnace process. The Cu leaching..... More