| Title |
Prevention of Irregular Growth of CuAg during Electrodeposition via Electrolytic Solution Activation |
| Authors |
(Hyeonbin Jou) ; (Jaehwan Kim) ; (Min Ki Park) ; (Yeunseok Ha) ; (Tae-Young Lee) ; (Nam Son Park) ; (Kyoung-Min Kim) ; (Seunghoe Choe) |
| DOI |
https://doi.org/10.3365/KJMM.2026.64.2.83 |
| ISSN |
1738-8228(ISSN), 2288-8241(eISSN) |
| Keywords |
CuAg alloy; Electrodeposition; Irregular growth; Tensile strength; Electrical conductivity; Electrolytic |
| Abstract |
Precisely controlling topology for target applications is considered crucial for the electrodeposition process, since the microstructural features directly determine the resulting physical and functional properties of the coating. In this study, we propose electrolytic solution activation as an efficient and practical method to suppress irregular growth of CuAg alloys during electrodeposition in an additive-free methanesulfonate-based solution. Comparative experiments revealed that CuAg foils obtained from a non-activated bath exhibit an irregular and rough surface morphology, which in turn results in low strength and poor electrical conductivity. |