| Cu-Sn계 솔더와 기판 사이의 Ni층의 두께와 열처리 시간에 따른 금속간화합물의 기계적 특성 |
| 김이슬1, 권지혜1, 유다영2, 박성규2, 이다정2, 이동윤1,2,3,* |
1부산대학교 차세대기판학과
2부산대학교 나노융합기술학과
3부산대학교 나노에너지공학과 |
| Influence of Nickel Thickness and Annealing Time on the Mechanical Properties of Intermetallic Compounds Formed between Cu-Sn Solder and Substrate |
| Yiseul Kim1, Jeehye Kwon1, Dayoung Yoo2, Sungkyu Park2, Dajeong Lee2, Dongyun Lee1,2,3,* |
1Department of Advanced Circuit Interconnection, Pusan National University, Busan 46241, Republic of Korea
2Department of Nano Fusion Technology, Pusan National University, Busan 46241, Republic of Korea
3Department of Nanoenergy Engineering, Pusan National University, Busan 46241, Republic of Korea |
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Received: 22 July 2016; Accepted: 13 December 2016. Published online: 3 March 2017. |
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| ABSTRACT |
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Intermetallic compounds (IMCs) developed on the interface between a solder alloy and its bonding pads are an important factor in the failure of electronic circuits. In this study, the mechanical behaviors of the IMCs formed in the Cu-Ni-Sn ternary alloy system are investigated. Presumably, Ni can act as a diffusion barrier to Cu and Sn to form the IMCs. Detailed analysis of the microstructure is conducted using an electron probe micro-analyzer (EPMA). The addition of Ni softened the IMCs, which is determined based on the fracture toughness increasing (from 0.71 to 1.55 MPa√m) with the Ni layer thickness. However, above a critical amount of Ni involved in the Cu-Sn IMCs, the softening effect is diminished, and this could result from the segregation of Ni inside the IMCs. Therefore, the optimized condition must be determined in order to obtain a positive Ni effect on enhancing the reliability of the electronic circuits. |
| Keywords:
Pb-free solder; Intermetallic compound; mechanical properties, nanoindentation |
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