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저융점합금 라인을 이용한 플렉시블 OLED 봉지
Received: 1 October 2018;  Accepted: 11 February 2019.  Published online: 7 March 2019.
We have developed an encapsulation technology for OLED devices using an LMPA sealing line to enhance barrier characteristics against moisture and oxygen penetration. To verify the potential of this technology for application as a flexible substrate, three experimental factors were investigated in this study. First, the stability of the sealing line on the flexible substrate after repetitive bending was investigated by measuring changes in line resistivity. Secondly, temperature evolution and distribution on the flexible substrate during thermal processes were investigated. Thirdly, an OLED sample with the edge sealing line was manufactured and the lifetime was compared with a reference sample. The results showed the potential value of the LMPA sealing line to enhance the reliability and lifetime of flexible OLED devices.
Keywords: OLED(Organic light emitting diode), sealing, encapsulation, LMPA, Cu(Copper)
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