| Cu foam / Cu plate 간 고상확산접합부의 인장성질에 미치는 접합압력과 유지시간의 영향 |
| 김상호1, 허회준1, 윤태진2, 강정윤1 |
1부산대학교 재료공학과
2부산대학교 하이브리드소재솔루션 핵심연구센터 |
| Effect of Bonding Pressure and Bonding Time on the Tensile Properties of Cu-Foam / Cu-Plate Diffusion Bonded Joint |
| Sang-Ho Kim1, Hoe-Jun Heo1, Tae-Jin Yoon2, Chung-Yun Kang1 |
1Depart. of Material Science and Engineering, Pusan National University, Busan 46241, Republic of Korea
2National Core Research Center, Pusan National University, Busan 46241, Republic of Korea |
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Received: 4 May 2016; Accepted: 2 June 2016. Published online: 5 December 2016. |
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| ABSTRACT |
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Open cell Cu foam, which has been widely utilized in various industries because of its high thermal conductivity, lightweight and large surface area, was successfully joined with Cu plate by diffusion bonding. To prevent excessive deformation of the Cu foam during bonding process, the bonding pressure should be lower than 500 kPa at 800 ℃ for 60 min and bonding pressure should be lowered with increasing holding time. The bonding strength was evaluated by tensile tests. The tensile load of joints increased with the bonding pressure and holding time. In the case of higher bonding pressure or time, the bonded length at the interface was usually longer than the cross-sectional length of the foam, so fracture occurred at the foam. For the same reason, base metal (foam) fracture mainly occurred at the node-plate junction rather than in the strut-plate junction because the bonded surface area of the node was relatively larger than that of the strut. |
| Keywords:
foams, diffusion bonding, mechanical properties, tensile test, fractograph |
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