| 열처리 및 열 사이클 조건에 따른 전해 Cr/전해 Ni-P 도금의 접합강도 평가 및 계면분석 |
| 이진아1, 손기락1, 최명희2, 이규환3, 박영배1 |
1안동대학교 신소재공학부 청정에너지소재기술연구센터
2대경화학(주) 기술연구소
3한국기계연구원 부설 재료연구소 표면기술본부 |
| Effects of Heat Treatment and Thermal Cycle Conditions on the Bonding Strength and Interfacial Characteristics of Electroplated Cr/Electroplated Ni-P Coatings |
| Jina Lee1, Kirak Son1, Myung-Hee Choi2, Kyu Hwan Lee3, Young-Bae Park1 |
1School of Materials Science and Engineering, Andong National University, Andong 36729, Republic of Korea
2DAEKYUNG CHEM. CO. LTD., Institute of Technology, Busan 49478, Republic of Korea
3Surface Technology Division, Korea Institute of Materials Science, Changwon 51508, Republic of Korea |
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Received: 7 November 2017; Accepted: 12 January 2018. Published online: 5 April 2018. |
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| ABSTRACT |
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The effects of heat treatment and thermal cycle conditions on the bonding strength and interfacial characteristics of electroplated Cr/electroplated Ni-P coatings were systematically evaluated. With step1 samples, heat treatment was performed at 750 oC for 6 hours after successive electroplating of Ni-P and Cr layers. With step2 samples, 1st heat treatment was performed at 500 oC for 3 hours after electroplating Ni- P, and then 2nd heat treatment was performed at 750 oC for 6 hours after electroplating Cr. The bonding strengths measured by ASTM C633 were around 54.6 MPa before thermal cycling, and decreased to 35 MPa and 29.9 MPa for the step1 and the step2, respectively, after 1,000 cycles between 150~600 oC. Increasing the number of thermal cycles led to an increasing adhesive/Cr interface delaminated mode, which seemed to be closely related to the decreaed bonding strength possibly due to severe surface Cr oxidation. Also, the higher residual stress was investigated in the step1 than step2 samples. It is thought to be responsible for the higher density of channeling cracks in the Cr layer, which led to slightly stronger bonding strength due to the mechanical interlocking effects of the adhesive inside the channeling cracks. |
| Keywords:
metals, plating, microstructure, tensile test, thermal cycle |
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