전해 동박의 표면 형상 및 기계적 물성에 미치는 SPS 첨가제 영향 |
우태규 |
전북대학교 공과대학 신소재공학부 |
The Effects of Bis(3-Sulfo-Propyl)di-Sulfide (SPS) Additives on the Surface Morphology and Mechanical Properties of Electrolytic Copper Foil |
Tae-Gyu Woo |
Division of Advanced Materials Engineering, College of Engineering, Chonbuk National University, Jeonbuk 54896, Republic of Korea |
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Received: 13 October 2015; Accepted: 29 March 2016. Published online: 5 September 2016. |
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ABSTRACT |
In this study the effects of Bis(3-Sulfo-Propyl)di-Sulfide (SPS) on the elongation, surface morphology and crystal structure of electrolytic copper foil were investigated. Additives HEC (hydroxyethyl cellulose) (A), SPS(B), Coll-A(C) were used in the study, and the additive used as D was a Cl- ion. The study results show that there are large differences in surface roughness and elongation depending on the amount of SPS added, from 0 ppm ~ 40 ppm. In this study, it was verified that the SPS additive plays the role of an accelerating agent, and makes it possible to control grain sizes. Also, the elongation rate increased, with increasing amounts of SPS. In addition, it was determined that SPS improves both the grain size and elongation rate due to its effect on the crystal structure. The addition of 40 ppm SPS resulted in a low surface roughness of less than 1 μm, and the sample showed both low tensile strength and large grain size. Here, the elongation was 9.0%, which represents an increase in elongation of about 300% compared to not adding the additive SPS. |
Keywords:
electroplating, copper, organic additive, elongation, surface morphology |
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