| 열간 압축 방법으로 제작된 Bi0.42Sb1.58Te3 열전소재 복합체에서 Cu 도핑이 출력인자에 미치는 효과에 대한 연구 |
| 임영수1, 송민석2, 이순일2, 서원선2 |
1부경대학교 신소재시스템공학과
2한국세라믹기술원 에너지환경소재본부 |
| Effects of Cu-doping on the Power Factor of Bi0.42Sb1.58Te3 Thermoelectric Compounds Prepared by Hot Pressing |
| Young Soo Lim1, Minseok Song2, Soonil Lee2, Won-Seon Seo2 |
1Department of Materials Syetem Engineering, Pukyong National University, Busan 48547, Republic of Korea
2Energy and Environmental Division, Korea Institute of Ceramic Engineering and Technology, Jinju 52851, Republic of Korea |
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Received: 4 October 2016; Accepted: 22 December 2016. Published online: 1 June 2017. |
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| ABSTRACT |
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We report the effects of incorporated Cu on the thermoelectric transport properties of Bi0.42Sb1.58Te3 compounds prepared by the hot pressing method. The hole concentration in the compound increased significantly with the increase in the Cu content. The acceptor role of Cu was manifested by Hall measurements and also by the temperature-dependent Seebeck coefficient. Mobility in the compound was mainly governed by phonon scattering, and was additionally affected by ionized impurity scattering. Density-of-state effective mass increased with the Cu content and its effects on the power factor were discussed. |
| Keywords:
thermoelectric, bismuth telluride, hot pressing, charge transport, power factor |
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