| 알루미늄-구리 이종 도체 접합부에서 직류 전기 인가에 따른 금속간화합물의 성장 거동 |
| 김정익1,2, 진성우1, 정진욱1, 성현민1, 정혜진1, 박시욱1, 박주원1, 한흥남1 |
1서울대학교 재료공학부
2LS전선(주) 기반기술연구소 |
| Growth Behavior of Intermetallic Compound in Dissimilar Al-Cu Joints Under Direct Current |
| Jeong-Ik Kim1,2, Sung-woo Jin1, Jinwook Jung1, Hyun-Min Sung1, Hye-Jin Jeong1, Siwook Park1, Ju-Won Park1, Heung Nam Han1 |
1Department of Materials Science and Engineering and Research Institute of Advanced Materials, Seoul National University, Seoul 08826, Republic of Korea
2R&D Center, LS Cable & System, Gunpo-si 15845, Republic of Korea |
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Received: 8 December 2016; Accepted: 3 January 2017. Published online: 1 June 2017. |
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| ABSTRACT |
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Aluminum conductors are increasingly replacing copper because Al has lower cost and lighter weight, and consequently the demand for Al-Cu joints for industrial applications is growing. However, an intermetallic compound is known to grow at the Al-Cu interface, and will result in fracture if it grows above a critical thickness. It has been reported that the thickness of this intermetallic compound layer significantly increases when alternating current flows through the Al-Cu interface. For long distance power transmission, direct current is preferred because it reduces energy losses. In the present study, the formation and growth of the intermetallic compound under direct current was investigated using FE-SEM and EPMA. The thickness of the intermetallic compound was measured and compared based on the direction of the electron flows. It was thus confirmed that under commercial conditions below 10A/mm2 the electric current accelerates the growth of the intermetallic compound, with distinct effect from electromigration. In addition, an empirical equation to predict the thickness of the intermetallic compound was obtained, to estimate the life time of the Al-Cu joint. |
| Keywords:
conductors, intermetallics, joining, welding, diffusion, direct current |
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