![]() |
The Effects of Bis(3-Sulfo-Propyl)di-Sulfide (SPS) Additives on the Surface Morphology and Mechanical Properties of Electrolytic Copper Foil
Tae-Gyu Woo
Korean J. Met. Mater.. 2016;54(9):681-687. Published online 2016 Sep 5 DOI: https://doi.org/10.3365/KJMM.2016.54.9.681
|
Citations to this article as recorded by
Microstructure analysis of 8 μm electrolytic Cu foil in plane view using EBSD and TEM
Myeongjin Kim, Hyun Soon Park
Applied Microscopy.2022;[Epub] CrossRef Effects of JGB Additives on the Microstructures and Electrical Properties of Electroplated Copper Foil
Tae-Gyu Woo, Il-Song Park
Korean Journal of Metals and Materials.2021; 59(6): 404. CrossRef Changes in Electrical Properties of Copper-Plated Layer by Organic Additives on High Current Density
Tae-Gyu Woo, Il-Song Park
Korean Journal of Metals and Materials.2020; 58(1): 41. CrossRef Main Effects of Plating Parameters on Mechanical and Surface Properties of Electroplated Copper
Tae-Gyu Woo, Il-Song Park, Kyeong-Won Seol
Korean Journal of Metals and Materials.2018; 56(6): 459. CrossRef Effect of Gelatin and Chloride Ions on the Mechanical Properties and Microstructural Evolution of Copper Foil
Tae-Gyu Woo, Man-Hyung Lee, Kyeong-Won Seol
Korean Journal of Metals and Materials.2018; 56(7): 518. CrossRef
|