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Research Papers
소결온도 변화에 따른 Binderless-WC 소결체 특성평가
박현국 · 이정한 · 장준호 · 오익현

Received 2018 Dec 14     Accepted 2019 Mar 27     Published online 2019 Apr 10
Abstract
In this study, Binderless-WC hard materials were fabricated using the pulsed current activated sintering (PCAS) process for a Friction Stir Welding tool and difficult-to-cut tool application. Tungsten carbide (WC) hard materials are used in various industries and possess a superior hardness compared to other hard materials. They have particularly high... More
      
광전 손실과 핀홀 생성의 억제를 통한 유연 투명 TiO2/Cu/ZnO 전극의 최적화 연구
정은욱 · 이건환 · 조영래 · 윤정흠

Received 2019 Mar 18     Accepted 2019 Mar 28     Published online 2019 Apr 10
Abstract
We demonstrated an effective method for fabricating a highly efficient flexible transparent electrode in an oxide/metal/oxide configuration based on an ultrathin Cu film. It exhibited low losses in optical transmittance and electrical conductivity while minimizing current loss due to pinhole-related leakages. The Cu film was developed on a chemically heterogeneous ZnO... More
      
Electronic Transport and Thermoelectric Properties of Cu12-xZnxSb4S13 Tetrahedrites Prepared by Mechanical Alloying and Hot Pressing
Sung-Gyu Kwak, Go-Eun Lee, and Il-Ho Kim

Received 2019 Feb 27     Accepted 2019 Mar 21     Published online 2019 Apr 10
Abstract
Tetrahedrite Cu12Sb4S13 has low lattice thermal conductivity because of the lone-pair electrons of Sb, which cause the Cu atoms to vibrate at a low frequency and high amplitude. When the Cu atoms of Cu12Sb4S13 are partially substituted with a transition metal, changes in the Cu vibrations can intensify phonon scattering,... More
      
AlN 기계적 성질에 미치는 BN 첨가 영향
조우진 · 오세훈 · 손인진

Received 2019 Jan 7     Accepted 2019 Jan 31     Published online 2019 Apr 10
Abstract
Aluminum nitride (AlN) has several attractive properties including high thermal conductivity, excellent electrical insulation, a thermal expansion coefficient close to that of Si and low density. Accordingly, it is considered a promising packing material and substrate for high power integrated circuits. However, its low fracture toughness at room temperature limits its... More
      
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