Abstract
The effects of annealing temperature and thermal cycle conditions on the adhesion characteristics of non-cyanide Si/sputter TiW/sputter Au/Au bump structure were systematically investigated using a shear test. No intermetallic compound was observed at the TiW/Au interface at all annealing temperatures, and voids formed between the TiW and Au bump interface..... More

Abstract
The effects of post-annealing times at 150°C on the bonding strength and interfacial characteristics of Cu/Sn-3.0Ag-0.5Cu (SAC305)/Al were systematically evaluated. In the as-bonded sample, Cu₆Sn₅ intermetallic compound (IMC) was formed at the upper Cu/SAC305 interface, while Ag₃Al IMC was formed at the lower SAC305/Al interface, and a black layer of..... More

Abstract
The effects of heat treatment and thermal cycle conditions on the bonding strength and interfacial characteristics of electroplated Cr/electroplated Ni-P coatings were systematically evaluated. With step1 samples, heat treatment was performed at 750 ^oC for 6 hours after successive electroplating of Ni-P and Cr layers. With step2 samples, 1st heat..... More

Abstract
The effect of current densities on the electromigration (EM) failure mechanism of flip chip Cu/Ni/Sn-Ag/Cu solder bumps was investigated under stressing conditions at current densities ranging from 5.0~6.9 × 10³ A/cm² at 150 ℃. The EM failure times at 5.0 × 10³ A/cm² were around 11 times longer than at..... More