Abstract
With the increasing numbers of electric vehicles and the prevalence of high heat generating devices, recent studies have attempted to address the limitations of conventional solder materials, including their low durability at temperatures exceeding 200 ℃, insufficient mechanical properties in a joint, and low thermal conductivity. Transient liquid-phase (TLP) partial..... More

Abstract
To rapidly sinter a bondline and obtain mechanical stability at high temperature and high thermal conductivity, 1.5 μm Ag particles with enhanced surface area were synthesized by a wet-chemical method, and a sinter-bonding paste containing these Ag particles was obtained. Some particles were present in the form of agglomerates of..... More