Korean J. Met. Mater.
2019;57(5):310-315. Published online 2019 Apr 10
Aluminum nitride (AlN) has several attractive properties including high thermal conductivity, excellent electrical insulation, a thermal expansion coefficient close to that of Si and low density. Accordingly, it is considered a promising packing material and substrate for high power integrated circuits. However, its low fracture toughness at room temperature limits..... More