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Solder Joint Fatigue Life of Flexible Impact Sensor Module for Automotive Electronics
자동차 에어백용 플렉시블 충격센서 모듈의 솔더 접합부 피로수명

Ji-Yeon Park, Mi-Song Kim, Chulmin Oh, Sang Hyeon Do, Jong Dock Seo, Dae Keun Kim, Won Sik Hong
박지연, 김미송, 오철민, 도상현, 서종덕, 김대근, 홍원식

Korean J. Met. Mater. 2017;55(4):232-239. Published online 2017 Apr 6
DOI: https://doi.org/10.3365/KJMM.2017.55.4.232

Abstract
To improve the sensitivity of impact sensor modules for automotive air bag systems, we developed a flexible module. The impact sensor was soldered with Sn-3.0Ag-0.5Cu (SAC305) solder on a flexible printed circuit board (FPCB) with an organic solderability preservative (OSP) surface finish. Thermal shock (TS) is one of the test..... More

Crossref 8

Kinetics of Intermetallic Compounds Growth Induced by Electromigration of Sn-0.7Cu Solder
Electromigration에 의한 Sn-0.7Cu 솔더 금속간화합물 성장 예측

Min-Hyeok Heo, Namhyun Kang, Seonghun Park, Jun-Ki Kim, Won Sik Hong
허민혁, 강남현, 박성훈, 김준기, 홍원식

Korean J. Met. Mater. 2016;54(12):908-915. Published online 2016 Dec 5
DOI: https://doi.org/10.3365/KJMM.2016.54.12.908

Abstract
The reliability of printed circuit boards (PCB) has emerged as a critical concern as the size of solder bump decreases and current density to solder bump increases by fine pitch formation. The main failure mode of solder bumps is open-circuits due to void formation as intermetallic compounds (IMC) grow, mainly..... More

Crossref 4

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