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Mechanical Properties and Fabrication of 4YSZ-BN Composites by Pulsed Current Activated Sintering
펄스 전류 활성 소결에 의한 4YSZ-BN 복합재료 제조와 기계적 성질
Woo-Jin Cho, Seong-Eun Kim, Se-Hoon Oh, In-Jin Shon
조우진, 김성은, 오세훈, 손인진
Korean J. Met. Mater. 2019;57(12):764-770.   Published online 2019 Nov 22
DOI: https://doi.org/10.3365/KJMM.2019.57.12.764

Abstract
4YSZ is generally used in fuel cells, oxygen sensors, hip and knee joint replacements and thermal barriers because of it excellent properties, including low density, high biocompatibility, good resistance against corrosion, hard phase and high melting point, and high ionic conductivity. However, 4YSZ with large grain has low resistance to..... More

                   Web of Science 1  Crossref 1
Mechanical Properties and Fabrication of a Nanostructured Nb-Al2O3 Composite by High Frequency Induction Heating
고주파 유도 가열에 의한 나노구조의 Nb-Al2O3 복합재료 제조와 기계적 성질
Seong-Eun Kim, Se-Hoon Oh, In-Jin Shon
김성은, 오세훈, 손인진
Korean J. Met. Mater. 2019;57(11):701-707.   Published online 2019 Nov 5
DOI: https://doi.org/10.3365/KJMM.2019.57.11.701

Abstract
Al2O3 has a high Young’s modulus (380 GPa), a low density (3.98 g· cm-3), good high-temperature mechanical properties, biocompatibility and excellent oxidation resistance. Al2O3 has been used for automotive, aerospace, bio-materials and various industrial applications. Despite its various merits, the low fracture toughness of the material below the brittle-ductile transition..... More

                   Web of Science 2  Crossref 1
Effect of BN Addition on the Mechanical Properties of AlN
AlN 기계적 성질에 미치는 BN 첨가 영향
Woo-Jin Cho, Se-Hoon Oh, In-Jin Shon
조우진, 오세훈, 손인진
Korean J. Met. Mater. 2019;57(5):310-315.   Published online 2019 Apr 10
DOI: https://doi.org/10.3365/KJMM.2019.57.5.310

Abstract
Aluminum nitride (AlN) has several attractive properties including high thermal conductivity, excellent electrical insulation, a thermal expansion coefficient close to that of Si and low density. Accordingly, it is considered a promising packing material and substrate for high power integrated circuits. However, its low fracture toughness at room temperature limits..... More

                   Web of Science 10  Crossref 9
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