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The Effect of Microstructures in AZ31, Al5052, and Cu on Electromagnetic Shielding Effectiveness
AZ31, Al5052, Cu 미세조직이 전자파 차폐 효과에 미치는 영향
Kyeng-Taek Kim, Seong-Je Kim, Min-Hyeok Kang, Sangbong Yi
김경택, 김성제, 강민혁, 이상봉
Korean J. Met. Mater. 2025;63(3):224-230.   Published online 2025 Mar 5
DOI: https://doi.org/10.3365/KJMM.2025.63.3.224

Abstract
With the widespread use of electronic devices in the telecommunications industry, exposure to electromagnetic waves has largely increased in the last decades. In addition to concerns about heath issues caused by an accumulative exposure to electromagnetic waves, electromagnetic interference causes malfunctions in complex electronic devices and degrades signal quality. The..... More

                
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