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Influence of Boron and Manganese on Hot Crack Resistance and Low Temperature Toughness of Flux Cored Arc Weld Metal for High Strength Carbon Steels
고강도 탄소강 FCA 용착금속의 고온균열 저항성과 저온 충격인성에 미치는 보론과 망간의 영향
Su-Kil Park, Young-Ho Cho, Chun-Ho Jee, Junghoon Lee, Seong-Moon Seo, Namhyun Kang
박수길, 조영호, 지춘호, 이정훈, 서성문, 강남현
Korean J. Met. Mater. 2019;57(1):28-37.   Published online 2018 Dec 14
DOI: https://doi.org/10.3365/KJMM.2019.57.1.28

Abstract
The hot crack resistance and mechanical properties of flux cored arc (FCA) welds were investigated with three kinds of welding consumables having different boron (B) and manganese (Mn) contents for high strength carbon steel. The hot crack resistance, measured from self-restraint testing, strongly depended on the amount of B in..... More

                        
Kinetics of Intermetallic Compounds Growth Induced by Electromigration of Sn-0.7Cu Solder
Electromigration에 의한 Sn-0.7Cu 솔더 금속간화합물 성장 예측
Min-Hyeok Heo, Namhyun Kang, Seonghun Park, Jun-Ki Kim, Won Sik Hong
허민혁, 강남현, 박성훈, 김준기, 홍원식
Korean J. Met. Mater. 2016;54(12):908-915.   Published online 2016 Dec 5
DOI: https://doi.org/10.3365/KJMM.2016.54.12.908

Abstract
The reliability of printed circuit boards (PCB) has emerged as a critical concern as the size of solder bump decreases and current density to solder bump increases by fine pitch formation. The main failure mode of solder bumps is open-circuits due to void formation as intermetallic compounds (IMC) grow, mainly..... More

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