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Transient Liquid-Phase Sinter-Bonding Characteristics of a 5 um Cu@Sn Particle-Based Preform for High-Speed Die Bonding of Power Devices
파워 소자의 고속 다이 접합을 위한 5 um Cu@Sn 입자 기반 프리폼의 천이액상 소결접합 특성
Byeong Jo Han, Sang Ho Cho, Kang Rok Jeon, Jong-Hyun Lee
한병조, 조상호, 전강록, 이종현
Korean J. Met. Mater. 2024;62(1):12-21.   Published online 2023 Dec 29
DOI: https://doi.org/10.3365/KJMM.2024.62.1.12

Abstract
To ensure the high-temperature stability of a bondline under next-generation power devices such as SiC semiconductors, a die bonding test was performed by transient liquid-phase (TLP) sinter-bonding using a Sn-coated Cu (Cu@Sn) particle-based preform. Compared to the existing 20 min-bonding result using a 30 μm Cu@Sn particle-based preform, a 5..... More

                
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