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Liquid-Phase Reaction Sintering Behavior at below 200 °C and Electrical Sheet Resistance of Sn-58Bi/Cu Composite Pastes
Sn-58Bi/Cu 복합 페이스트의 200 °C 미만 액상 반응 소결 거동과 전기저항 변화
Jun Ho Hwang, Dongshin Jeong, Jong-Hyun Lee
황준호, 정동신, 이종현
Korean J. Met. Mater. 2018;56(6):440-448.   Published online 2018 Jun 4
DOI: https://doi.org/10.3365/KJMM.2018.56.6.440

Abstract
To fabricate a film with the highest electrical conductivity through liquid-phase reaction sintering below 200 °C using composite pastes containing both Sn-58Bi and Cu particles as a filler material, the effects of process parameters, such as the mixing ratio of the fillers, reaction temperature, and reaction time, were evaluated and..... More

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