Abstract
A Cu-based paste containing Cu formate and Cu particles was prepared for the compressionassisted sinter-bonding of Cu-finished wide-bandgap power devices onto a Cu-finished substrate at a relatively low bonding temperature of 250 oC in air. A mixture of Cu formate and Cu particles was designed to mitigate the tremendous volume..... More

Abstract
To ensure the high-temperature stability of a bondline under next-generation power devices such as SiC semiconductors, a die bonding test was performed by transient liquid-phase (TLP) sinter-bonding using a Sn-coated Cu (Cu@Sn) particle-based preform. Compared to the existing 20 min-bonding result using a 30 μm Cu@Sn particle-based preform, a 5..... More

Abstract
To suppress Ag dewetting from around 200 ^oC in Ag-coated Cu (Cu@Ag) flakes, Ag and Ni-coated Cu (Cu@Ni@Ag) flakes were fabricated by successive Ni and Ag electroless plating. The Ni bath type was an important consideration to induce differences in the Ag dewetting and resultant Cu oxidation. An acid Ni..... More

Abstract
With the increasing numbers of electric vehicles and the prevalence of high heat generating devices, recent studies have attempted to address the limitations of conventional solder materials, including their low durability at temperatures exceeding 200 ℃, insufficient mechanical properties in a joint, and low thermal conductivity. Transient liquid-phase (TLP) partial..... More

Abstract
To rapidly sinter a bondline and obtain mechanical stability at high temperature and high thermal conductivity, 1.5 μm Ag particles with enhanced surface area were synthesized by a wet-chemical method, and a sinter-bonding paste containing these Ag particles was obtained. Some particles were present in the form of agglomerates of..... More

Abstract
To fabricate a film with the highest electrical conductivity through liquid-phase reaction sintering below 200 °C using composite pastes containing both Sn-58Bi and Cu particles as a filler material, the effects of process parameters, such as the mixing ratio of the fillers, reaction temperature, and reaction time, were evaluated and..... More