Abstract
Interconnects in solid oxide fuel cells (SOFCs) serve as electrical pathways between individual cells while also separating the fuel and air streams in each cell. For SOFCs operating at low temperatures (600 ~ 800 ^oC), ferritic stainless steel with high Cr content is commonly used as the interconnect material. However,..... More

Abstract
To enhance the intrinsic yield strength of the ferrite-pearlite microstructure that inevitably forms in a non-quenched-and-tempered steel for large structural components, this study analyzed the effect of adding Si. The resulting ferrite-pearlite microstructure in medium-carbon steels was examined, and the resulting increase in yield strength was interpreted based on strengthening..... More

Abstract
To manufacture finer solder bumps, the SR and DFR patterns were filled using a Sn electroplating process instead of the microball process currently used in BGA technology, and the solder bump shape was fabricated through a reflow process. The microstructure of the solder bump was investigated by EBSD and TEM..... More

Abstract
Materials with very small dimensions exhibit different physical and mechanical properties compared to their bulk counterparts. This becomes significantly important for the thin films that are widely used as components in micro-electronics and functional materials. In this study, a chromium (Cr) thin film was deposited on a silicon (Si) wafer..... More

Abstract
To determine the origin of the inhomogeneous microstructure and texture observed in drawn and annealed high purity copper wires, two kinds of drawing process conditions and their influence was investigated. The regular condition, based on a symmetric die, and a condition designed intentionally to produce an inhomogeneous shear deformation using..... More