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Microstructural Analysis of Solder Bump Fabricated by Sn Electroplating on a PCB Substrate
Sn 도금을 통한 PCB 기판상의 솔더 범프 제작 및 미세조직 분석
Sang-Hyeok Kim, Seong-Jin Kim, Han-Kyun Shin, Hyun Park, Cheol-Ho Heo, Seongjae Moon, Hyo-Jong Lee
김상혁, 김성진, 신한균, 박현, 허철호, 문성재, 이효종
Korean J. Met. Mater. 2021;59(4):233-238.   Published online 2021 Mar 24
DOI: https://doi.org/10.3365/KJMM.2021.59.4.233

Abstract
To manufacture finer solder bumps, the SR and DFR patterns were filled using a Sn electroplating process instead of the microball process currently used in BGA technology, and the solder bump shape was fabricated through a reflow process. The microstructure of the solder bump was investigated by EBSD and TEM..... More

      
Effect of Shear Deformation During Drawing on Inhomogeneous Microstructures and Textures in High Purity Copper Wires After Annealing
고순도 구리 선재의 어닐링 후 불균질 미세조직과 집합조직에 미치는 신선 시 전단 변형의 영향
Hyun Park, Sang-Hyeok Kim, Se-Jong Kim, Hyo-Jong Lee
박현, 김상혁, 김세종, 이효종
Korean J. Met. Mater. 2018;56(12):861-869.   Published online 2018 Dec 5
DOI: https://doi.org/10.3365/KJMM.2018.56.12.861

Abstract
To determine the origin of the inhomogeneous microstructure and texture observed in drawn and annealed high purity copper wires, two kinds of drawing process conditions and their influence was investigated. The regular condition, based on a symmetric die, and a condition designed intentionally to produce an inhomogeneous shear deformation using..... More

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