Sang-Hyeok Kim, Seong-Jin Kim, Han-Kyun Shin, Hyun Park, Cheol-Ho Heo, Seongjae Moon, Hyo-Jong Lee김상혁, 김성진, 신한균, 박현, 허철호, 문성재, 이효종
Korean J. Met. Mater.
2021;59(4):233-238. Published online 2021 Mar 24
To manufacture finer solder bumps, the SR and DFR patterns were filled using a Sn electroplating process instead of the microball process currently used in BGA technology, and the solder bump shape was fabricated through a reflow process. The microstructure of the solder bump was investigated by EBSD and TEM..... More