Abstract
In this study, we tried to understand the difference in the mechanical properties (elastic modulus, E & hardness, H) values of CIGS compound semiconductors measured using the Berkovich indenter and the sharper cube corner and conical indenter. Adopted continuous stiffness measurement technique to characterize it along with the indentation depth...... More

Abstract
To measure the mechanical properties of Sb₂S₃, a two-component compound semiconductor used in the light absorption layer of a solar cell, Sb₂S₃ thin films were formed on FTO glass using the spin coating method. The spin-coated Sb₂S₃ thin films were heat-treated at 200 ^oC in an Ar atmosphere for up..... More

Abstract
Intermetallic compounds (IMCs) developed on the interface between a solder alloy and its bonding pads are an important factor in the failure of electronic circuits. In this study, the mechanical behaviors of the IMCs formed in the Cu-Ni-Sn ternary alloy system are investigated. Presumably, Ni can act as a diffusion..... More