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Microstructural Analysis of Solder Bump Fabricated by Sn Electroplating on a PCB Substrate
Sn 도금을 통한 PCB 기판상의 솔더 범프 제작 및 미세조직 분석
Sang-Hyeok Kim, Seong-Jin Kim, Han-Kyun Shin, Hyun Park, Cheol-Ho Heo, Seongjae Moon, Hyo-Jong Lee
김상혁, 김성진, 신한균, 박현, 허철호, 문성재, 이효종
Korean J. Met. Mater. 2021;59(4):233-238.   Published online 2021 Mar 24
DOI: https://doi.org/10.3365/KJMM.2021.59.4.233

Abstract
To manufacture finer solder bumps, the SR and DFR patterns were filled using a Sn electroplating process instead of the microball process currently used in BGA technology, and the solder bump shape was fabricated through a reflow process. The microstructure of the solder bump was investigated by EBSD and TEM..... More

      
Effects of Two-Step Anodization on Surface Wettability in Surface Treatment of Aluminum Alloy
알루미늄 합금의 표면처리에 있어서 2단계 양극산화의 젖음성 영향
Jae Dong Eo, Jingyu Kim, Yongsug Jung, Jong-Hang Lee, Wook Bae Kim
어재동, 김진규, 정용석, 이종항, 김욱배
Korean J. Met. Mater. ;59(2):73-80.   Published online 2021 Jan 27
DOI: https://doi.org/10.3365/KJMM.2021.59.2.73

Abstract
Industrial anodizing of aluminum alloys is widely employed for various products, to improve corrosion and contamination protection as well as aesthetic appearance. At the same time, nanostructure fabrication using highly ordered porous aluminum oxides has been increasingly investigated in academic research for diverse micro-/nano applications. This approach is based on..... More

                        
Wetting Behavior of Liquids on Micro-Patterned Polymer Surfaces Fabricated by Thermal Imprinting
Kwang-Jin Bae, Wenhui Yao, Yiliang He, Young-Rae Cho
Korean J. Met. Mater. 2017;55(9):624-631.   Published online 2017 Aug 30
DOI: https://doi.org/10.3365/KJMM.2017.55.9.624

Abstract
The wetting behavior of liquids on solid surfaces is important in the study of surfaces and interfaces. In this study, the wetting behavior of deionized (DI) water and hexadecane on fluorinated and micro-patterned polymer surfaces was investigated. The sample surfaces were processed by spray coating and thermal imprinting, respectively. The..... More

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