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Deposition of Low-Resistivity Aluminum Thin Films Via Application of Substrate Bias During Magnetron Sputtering
기판 바이어스와 스퍼터 압력 조절을 통한 저저항 알루미늄 박막 형성 연구
Dooho Choi
최두호
Korean J. Met. Mater. 2020;58(10):715-720.   Published online 2020 Oct 5
DOI: https://doi.org/10.3365/KJMM.2020.58.10.715

Abstract
In this study, the critical role of substrate bias during the sputter deposition of Al thin films is discussed. Two sets of Al thin films having a nominal thickness of 300 nm were deposited at sputtering pressures of 4.1 and 1.5 mTorr, respectively, with an applied negative substrate bias in..... More

                        
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