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Microstructural Analysis of Solder Bump Fabricated by Sn Electroplating on a PCB Substrate
Sn 도금을 통한 PCB 기판상의 솔더 범프 제작 및 미세조직 분석
Sang-Hyeok Kim, Seong-Jin Kim, Han-Kyun Shin, Hyun Park, Cheol-Ho Heo, Seongjae Moon, Hyo-Jong Lee
김상혁, 김성진, 신한균, 박현, 허철호, 문성재, 이효종
Korean J. Met. Mater. 2021;59(4):233-238.   Published online 2021 Mar 24
DOI: https://doi.org/10.3365/KJMM.2021.59.4.233

Abstract
To manufacture finer solder bumps, the SR and DFR patterns were filled using a Sn electroplating process instead of the microball process currently used in BGA technology, and the solder bump shape was fabricated through a reflow process. The microstructure of the solder bump was investigated by EBSD and TEM..... More

      
Effect of Current Densities on the Electromigration Failure Mechanisms of Flip-Chip Sn-Ag Solder Bump
전류밀도에 따른 플립칩 Sn-Ag 솔더 범프의 Electromigration 손상기구 분석
Gahui Kim, Kirak Son, Gyu-Tae Park, Young-Bae Park
김가희, 손기락, 박규태, 박영배
Korean J. Met. Mater. 2017;55(11):798-805.   Published online 2017 Oct 31
DOI: https://doi.org/10.3365/KJMM.2017.55.11.798

Abstract
The effect of current densities on the electromigration (EM) failure mechanism of flip chip Cu/Ni/Sn-Ag/Cu solder bumps was investigated under stressing conditions at current densities ranging from 5.0~6.9 × 103 A/cm2 at 150 ℃. The EM failure times at 5.0 × 103 A/cm2 were around 11 times longer than at..... More

      
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