Abstract
To manufacture finer solder bumps, the SR and DFR patterns were filled using a Sn electroplating process instead of the microball process currently used in BGA technology, and the solder bump shape was fabricated through a reflow process. The microstructure of the solder bump was investigated by EBSD and TEM..... More

Abstract
The effect of current densities on the electromigration (EM) failure mechanism of flip chip Cu/Ni/Sn-Ag/Cu solder bumps was investigated under stressing conditions at current densities ranging from 5.0~6.9 × 10³ A/cm² at 150 ℃. The EM failure times at 5.0 × 10³ A/cm² were around 11 times longer than at..... More