Abstract
The effect of current densities on the electromigration (EM) failure mechanism of flip chip Cu/Ni/Sn-Ag/Cu solder bumps was investigated under stressing conditions at current densities ranging from 5.0~6.9 × 10³ A/cm² at 150 ℃. The EM failure times at 5.0 × 10³ A/cm² were around 11 times longer than at..... More