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Cleavage Dicing Mechanics in Silicon Wafers
실리콘 웨이퍼의 그리비지 다이싱 역학
Seong-Min Lee, Yeon-Wook Kim
이성민, 김연욱
Korean J. Met. Mater. 2019;57(11):689-694.   Published online 2019 Nov 5
DOI: https://doi.org/10.3365/KJMM.2019.57.11.689

Abstract
This article details how effectively dicing damage of silicon wafers can be mechanically minimized by appropriate laser-induced groove formation prior to wafer separation. Various laser dicing factors, such as the laser-control power, the scan rate and the scan number of the laser beam, were estimated to determine the optimum groove..... More

                        
Electronic Materials
Effect of Sawing Velocity Variation on Chipping Damage of Semiconductor Wafers with Different Thicknesses
다이싱 속도 변화가 두께가 차별화된 반도체 웨이퍼의 칩핑 손상에 미치는 영향
Seong-Min Lee
이성민
Korean J. Met. Mater. 2016;54(8):598-604.   Published online 2016 Aug 5
DOI: https://doi.org/10.3365/KJMM.2016.54.8.598

Abstract
This work details how the sawing velocity influences the chipping damage of semiconductor wafers with different thicknesses during wafer separation. The experimental result shows that at a sawing velocity higher than 60000 rpm, in thinner wafers the magnitude of chipping damage more strongly depends on the revolving velocity of the..... More

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