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Korean J. Met. Mater.
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Korean J. Met. Mater.
2022;60(1):68-75. Published online 2021 Dec 10
DOI:
https://doi.org/10.3365/KJMM.2022.60.1.68
Abstract
A copper (Cu) metal-ceramic filler composite with high thermal conductivity and a suitable thermal expansion coefficient was designed for application as a high-performance heat dissipation material. The purpose of the designed material was to utilize the high thermal conductivity of Cu while lowering its high coefficient of thermal expansion by.....
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