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Effect of Cr Electroplating Layer Thickness on the Tensile and High Cycle Fatigue Properties of AISI 1045 Steel
AISI 1045 강의 인장 및 고주기 피로 특성에 미치는 Cr 도금층 두께의 영향
Gi-Su Ham, Yeon-Ji Kang, Hyung-Jun Kim, Sang-Hoon Yoon, Kee-Ahn Lee
함기수, 강연지, 김형준, 윤상훈, 이기안
Korean J. Met. Mater. 2019;57(3):138-145.   Published online 2019 Feb 14
DOI: https://doi.org/10.3365/KJMM.2019.57.3.138

Abstract
This study investigated and compared the tensile and high-cycle fatigue properties of AISI 1045 steel and Cr electroplated AISI 1045 steel. First, tensile and fatigue specimens were machined from AISI 1045 steel (substrate), and two kinds of Cr electroplating layers with different layer thickness were applied. The substrate, AISI 1045..... More

                        
Effect of Oxi-Nitrocarburizing on the Microstructure, Nanohardness and Corrosion Properties for Low Carbon Steel
산질화처리가 저탄소강의 미세조직과 나노경도 및 부식특성에 미치는 영향
Young-Wook Cho, Jong-Ho Won, Jeong-Ho Woo, Sang-Ho Yu, Young-Rae Cho
조영욱, 원종호, 우정호, 유상호, 조영래
Korean J. Met. Mater. 2018;56(4):289-295.   Published online 2018 Apr 5
DOI: https://doi.org/10.3365/KJMM.2018.56.4.289

Abstract
Oxi-nitrocarburizing treatment was performed to improve the anti-corrosion and anti-wear properties of low carbon steels. The oxi-nitrocarburizing was carried out in 2 steps: a gas nitrocarburizing step at 560 ℃ and an oxidation step at 550 ℃ for 30 min with steamed water. The mechanical and chemical properties of the..... More

         Cited By 1
Influence of Nickel Thickness and Annealing Time on the Mechanical Properties of Intermetallic Compounds Formed between Cu-Sn Solder and Substrate
Cu-Sn계 솔더와 기판 사이의 Ni층의 두께와 열처리 시간에 따른 금속간화합물의 기계적 특성
Yiseul Kim, Jeehye Kwon, Dayoung Yoo, Sungkyu Park, Dajeong Lee, Dongyun Lee
김이슬, 권지혜, 유다영, 박성규, 이다정, 이동윤
Korean J. Met. Mater. 2017;55(3):165-172.   Published online 2017 Mar 3
DOI: https://doi.org/10.3365/KJMM.2017.55.3.165

Abstract
Intermetallic compounds (IMCs) developed on the interface between a solder alloy and its bonding pads are an important factor in the failure of electronic circuits. In this study, the mechanical behaviors of the IMCs formed in the Cu-Ni-Sn ternary alloy system are investigated. Presumably, Ni can act as a diffusion..... More

      
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