Korean J. Met. Mater. 2018;56(12):915-920. Published online 2018 Dec 5
DOI:
https://doi.org/10.3365/KJMM.2018.56.12.915
Abstract
With the development of modern microelectronics technologies, the power density of electronic devices is rapidly increasing, due to the miniaturization or integration of device elements which operate at high frequency, high power conditions. Resulting thermal problems are known to cause power leakage, device failure and deteriorated performance. To relieve heat.....
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