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Microstructural Analysis of Solder Bump Fabricated by Sn Electroplating on a PCB Substrate
Sn 도금을 통한 PCB 기판상의 솔더 범프 제작 및 미세조직 분석
Sang-Hyeok Kim, Seong-Jin Kim, Han-Kyun Shin, Hyun Park, Cheol-Ho Heo, Seongjae Moon, Hyo-Jong Lee
김상혁, 김성진, 신한균, 박현, 허철호, 문성재, 이효종
Korean J. Met. Mater. 2021;59(4):233-238.   Published online 2021 Mar 24
DOI: https://doi.org/10.3365/KJMM.2021.59.4.233

To manufacture finer solder bumps, the SR and DFR patterns were filled using a Sn electroplating process instead of the microball process currently used in BGA technology, and the solder bump shape was fabricated through a reflow process. The microstructure of the solder bump was investigated by EBSD and TEM..... More

Changes in Electrical Properties of Copper-Plated Layer by Organic Additives on High Current Density
고전류밀도에서 유기첨가제에 의한 구리 전착층의 전기적 특성 변화
Tae-Gyu Woo, Il-Song Park
우태규, 박일송
Korean J. Met. Mater. 2020;58(1):41-48.   Published online 2019 Dec 12
DOI: https://doi.org/10.3365/KJMM.2020.58.1.41

Electroplating has many economic advantages in producing copper foils. The easiest way to manufacture electroplated copper foil with various properties is to add appropriate additives. This study evaluated the surface properties, mechanical and electrical properties of copper foil electroplated in electrolytes containing the leveler JGB (Janus Green B). When the..... More

Optimization of Electrochemical Variables of Pulse-Reverse Electroplating in Trivalent Chromium Bath to Enhance the Corrosion Resistance of Chromium Film
3가 크롬 도금욕에서 펄스 도금의 전기화학적 변수 최적화를 통한 크롬 도금막의 내식성 향상 연구
Chaewon Lim, Dongwook Lim, Bonil Ku, Sang Eun Shim, Sung-Hyeon Baeck
임채원, 임동욱, 구본일, 심상은, 백성현
Korean J. Met. Mater. 2019;57(10):641-647.   Published online 2019 Sep 6
DOI: https://doi.org/10.3365/KJMM.2019.57.10.641

Electroplating chromium films in a trivalent chromium bath has been extensively investigated as a replacement for the conventional hexavalent chromium bath. However, commercialization of the trivalent chromium method has been hindered because the resulting chromium films exhibit inferior mechanical properties compared to hexavalent chromium coated film. In this study, we..... More

Effect of Gelatin and Chloride Ions on the Mechanical Properties and Microstructural Evolution of Copper Foil
젤라틴 및 염소이온 첨가에 의한 구리 박막의 미세조직 및 기계적 특성 고찰
Tae-Gyu Woo, Man-Hyung Lee, Kyeong-Won Seol
우태규, 이만형, 설경원
Korean J. Met. Mater. 2018;56(7):518-523.   Published online 2018 Jul 5
DOI: https://doi.org/10.3365/KJMM.2018.56.7.518

This study investigated the crystal structure and mechanical properties of copper foil electroplated by adjusting gelatin and chloride ions from 0 to 100 ppm. There was increased formation of spherical crystals and surface roughness on the surface of the electroplated layer when the gelatin was added, and the direction of..... More

Main Effects of Plating Parameters on Mechanical and Surface Properties of Electroplated Copper
구리 전해도금 변수의 기계적 특성 및 표면 특성에 미치는 주 효과 분석
Tae-Gyu Woo, Il-Song Park, Kyeong-Won Seol
우태규, 박일송, 설경원
Korean J. Met. Mater. 2018;56(6):459-464.   Published online 2018 Jun 4
DOI: https://doi.org/10.3365/KJMM.2018.56.6.459

Electroplated copper has been used as wiring in electronic circuit boards and as cathode materials for secondary batteries, and its usage has expanded into the construction industry because of its convenient production and high economic value. During the electroplating process, various parameters, such as crystal phase and size, can affect..... More

                           Cited By 1
Effect of Via Pitch on the Extrusion Behavior of Cu-filled TSV
Seho Kee, Wonjoong Kim, Jaepil Jung, Minhyung Choi
Korean J. Met. Mater. 2018;56(6):449-458.   Published online 2018 Jun 4
DOI: https://doi.org/10.3365/KJMM.2018.56.6.449

In this study, the extrusion behavior of Cu fill material in a through-Si-via (TSV) subjected to thermal loading was investigated. The Cu filling of the TSV was accomplished using pulse periodic reverse (PPR) electroplating. To study the extrusion, TSVs of varying via pitch were filled with Cu by electroplating. Defect-free Cu..... More

                           Cited By 1
Electronic Materials
The Effects of Bis(3-Sulfo-Propyl)di-Sulfide (SPS) Additives on the Surface Morphology and Mechanical Properties of Electrolytic Copper Foil
전해 동박의 표면 형상 및 기계적 물성에 미치는 SPS 첨가제 영향
Tae-Gyu Woo
Korean J. Met. Mater. 2016;54(9):681-687.   Published online 2016 Sep 5
DOI: https://doi.org/10.3365/KJMM.2016.54.9.681

In this study the effects of Bis(3-Sulfo-Propyl)di-Sulfide (SPS) on the elongation, surface morphology and crystal structure of electrolytic copper foil were investigated. Additives HEC (hydroxyethyl cellulose) (A), SPS(B), Coll-A(C) were used in the study, and the additive used as D was a Cl- ion. The study results show that there..... More

         Cited By 3
Corrosion & Surface Treatment
Effect of Potassium Persulfate on Current Efficiency for Gold Plating
금도금의 전류효율에 미치는 과황산칼륨 첨가의 영향
Injoon Son, Ho-Sang Sohn, Kyung Tae Kim
손인준, 손호상, 김경태
Korean J. Met. Mater. 2016;54(9):652-658.   Published online 2016 Sep 5
DOI: https://doi.org/10.3365/KJMM.2016.54.9.652

In this study, the effect of potassium persulfate on current efficiency for gold plating was investigated using electrochemical techniques. The current efficiency in the low-current-density range greatly decreased when potassium persulfate was added to the gold plating solution. However, the current efficiency in the high-current-density range did not change with..... More

         Cited By 1

우태규1,2 · 박종재3 · 박일송4,*

Received 2020 Nov 3     Accepted 2020 Nov 18     Published online 2021 Apr 6
In this study, we studied the surface and mechanical properties of multiple additives as well as the initial plating properties of individual additives. With the individual additive groups, copper crystals tended to converge at a stage above the critical amount of additive. When chloride ions were added, large crystals formed at several places... More
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