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Preparation of Electroformed Copper-Nickel Multi-Nano-Layers and Characterization of Their Electromagnetic Shielding Effectiveness
구리-니켈 다층 나노 도막 제조와 전자파 차폐 효과 평가
Yong Choi
최용
Korean J. Met. Mater. 2020;58(9):639-644.   Published online 2020 Aug 19
DOI: https://doi.org/10.3365/KJMM.2020.58.9.639

Abstract
Thin copper-nickel foil with multi-nano layers was prepared by pulse-electroforming to develop a high performance electromagnetic shielding material for electronic devices. The pulse electroforming conditions of the aqueous solution chemistry were selected based on the aqueous copper-nickel-sulfur phase diagram and an evaluation of the deposition rate using the finite element..... More

                        
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