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Korean J. Met. Mater.
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Korean J. Met. Mater.
2020;58(9):639-644. Published online 2020 Aug 19
DOI:
https://doi.org/10.3365/KJMM.2020.58.9.639
Abstract
Thin copper-nickel foil with multi-nano layers was prepared by pulse-electroforming to develop a high performance electromagnetic shielding material for electronic devices. The pulse electroforming conditions of the aqueous solution chemistry were selected based on the aqueous copper-nickel-sulfur phase diagram and an evaluation of the deposition rate using the finite element.....
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