Abstract
The effect of post-bond heat treatment (PBHT) on diffusion-bonded polycrystalline Ni-base alloy Hastelloy X (Ni-22Cr-18Fe-8Mo) was evaluated in this study. Diffusion bonding was conducted under a compressive pressure of 14 MPa in the temperature range of 1100-1200 ℃. While (Cr,Mo)-rich and (Mo,Si)-rich precipitates were developed along the interface at 1100..... More

Abstract
Open cell Cu foam, which has been widely utilized in various industries because of its high thermal conductivity, lightweight and large surface area, was successfully joined with Cu plate by diffusion bonding. To prevent excessive deformation of the Cu foam during bonding process, the bonding pressure should be lower than..... More