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Photoelectrochemical Properties of Copper Oxide Photoelectrode with Various Copper Oxide Buffer Layers
CuO 버퍼층 증착 횟수에 따른 CuO 광전극의 광전기화학적 특성 연구
Seung-Hwan Jeon, Yaejin Hong, Hyukhyun Ryu, Won-Jae Lee
전승환, 홍예진, 류혁현, 이원재
Korean J. Met. Mater. 2019;57(7):447-455.   Published online 2019 Jun 5
DOI: https://doi.org/10.3365/KJMM.2019.57.7.447

In this study, a CuO buffer layer was deposited on a fluorine-doped tin oxide (FTO) substrate using a spin coating method, and then a CuO photoelectrode was grown on the CuO buffer layer using a modified-chemical bath deposition (M-CBD) method. We investigated the morphological, structural, optical, electrical and photoelectrochemical properties..... More

Recent Progress in First Principle Calculation and High-Throughput Screening of Electrocatalysts: A Review
전기화학촉매의 제일원리 계산 및 하이스루풋 스크리닝 연구 동향: 리뷰
Changsoo Lee, Kihoon Bang, Doosun Hong, Hyuck Mo Lee
이창수, 방기훈, 홍두선, 이혁모
Korean J. Met. Mater. 2019;57(1):1-9.   Published online 2018 Dec 14
DOI: https://doi.org/10.3365/KJMM.2019.57.1.1

There are many ongoing efforts to develop sustainable, clean, efficient, and economical pathways to produce renewable energy sources to satisfy worldwide energy demands. Electrochemical conversion processes, such as water splitting, CO2 conversion and N2 electroreduction, have been considered as successful approaches to solve these energy issues. Over the past decade,..... More

Main Effects of Plating Parameters on Mechanical and Surface Properties of Electroplated Copper
구리 전해도금 변수의 기계적 특성 및 표면 특성에 미치는 주 효과 분석
Tae-Gyu Woo, Il-Song Park, Kyeong-Won Seol
우태규, 박일송, 설경원
Korean J. Met. Mater. 2018;56(6):459-464.   Published online 2018 Jun 4
DOI: https://doi.org/10.3365/KJMM.2018.56.6.459

Electroplated copper has been used as wiring in electronic circuit boards and as cathode materials for secondary batteries, and its usage has expanded into the construction industry because of its convenient production and high economic value. During the electroplating process, various parameters, such as crystal phase and size, can affect..... More

Effect of Carrier Gas on Microstructure and Macroscopic Properties of Tantalum Coating Layer Manufactured by Kinetic Spray Process
Kinetic spray 공정으로 제조된 탄탈럼 코팅층의 미세조직 및 물성에 미치는 송급 가스의 영향
Ga-Ryung Kim, Young-Kyun Kim, Hyung-Jun Kim, Kee-Ahn Lee
김가령, 김영균, 김형준, 이기안
Korean J. Met. Mater. 2018;56(5):360-365.   Published online 2018 May 8
DOI: https://doi.org/10.3365/KJMM.2018.56.5.360

This study attempted to utilizing the kinetic spray process to manufacture tantalum coating layer and investigated the effect of carrier gas on the microstructure and macroscopic properties of the coating layer. The initial powder feed stock was a massive powder with an average particle size of 24.35 μm and 99.99%..... More

         Cited By 1
A Study on the Soft Magnetic Properties and Compaction Density of Fe-based Nanocrystalline Powder Cores Mixed with Permalloy Powders
퍼멀로이 분말이 혼합된 철계 나노결정립 분말코어의 성형밀도와 연자성 특성에 관한 연구
Jeong Hoon Shin, Young Mok Jeong, Keun Yong Sohn, Won-Wook Park
신정훈, 정영목, 손근용, 박원욱
Korean J. Met. Mater. 2017;55(9):645-650.   Published online 2017 Aug 30
DOI: https://doi.org/10.3365/KJMM.2017.55.9.645

In this paper, the soft magnetic properties and compaction density of Fe-Si-B-Nb-Cu nanocrystalline powder cores, mixed with two kinds of permalloy powders (Ni70Fe30 or Ni50Fe50), have been closely studied. Permalloy powders having an average diameter of 4μm were added in the range of 5 to 15 wt%, and the powder..... More

Effect of Annealing Temperature on the Microstructure, Tensile Properties, and Fracture Behavior of Cold-Rolled High-Mn Light-Weight Steels
고망간 경량철강 냉연판재의 미세조직, 인장특성 및 파괴거동에 미치는 어닐링 온도의 영향
Jae-hyun Lee, Seong-Jun Park, Joonoh Moon, Jun-Yun Kang, Jun-Young Park, Tae-Ho Lee, Kyung Mox Cho
이재현, 박성준, 문준오, 강전연, 박준영, 이태호, 조경목
Korean J. Met. Mater. 2017;55(5):363-371.   Published online 2017 May 9
DOI: https://doi.org/10.3365/KJMM.2017.55.5.363
The effects of the annealing temperature on the microstructure and tensile properties of cold-rolled light-weight steels are investigated using two Fe-30Mn-xAl-0.9C alloys that contain different Al content. The initial alloy microstructure is composed of a single austenite or a mixture of austenite and ferrite depending on the nominal aluminum content.... More
         Cited By 6
Study of the Morphological, Structural, Optical and Photoelectrochemical Properties of Zinc Oxide Nanorods Grown Using a Microwave Chemical Bath Deposition Method
마이크로파 화학 용액 증착법을 이용하여 성장시킨 ZnO 나노로드의 형태학적, 구조적, 광학적 그리고 광전기화학적 특성 변화 연구
Sungjin Oh, Hyukhyun Ryu, Won-Jae Lee
오성진, 류혁현, 이원재
Korean J. Met. Mater. 2017;55(4):255-263.   Published online 2017 Apr 6
DOI: https://doi.org/10.3365/KJMM.2017.55.4.255

In this study, zinc oxide (ZnO) nanostructures were grown on a ZnO-buffered fluorine-doped tin oxide (FTO) substrate using a microwave chemical bath deposition method with different zinc oxide precursor concentrations from 0.01 to 0.5 M. We investigated the effects of the zinc oxide precursor concentration on the morphological, structural, optical..... More

         Cited By 1
Optical Devices & Energy Materials
Study of the Morphological, Structural and Photoelectrochemical Properties of TiO<sub>2</sub> Nanorods grown by Hydrothermal Method
수열합성법으로 성장시킨 TiO2 나노로드의 형태학적, 구조적, 광전기화학적 특성 연구
Hayoung Choi, Hyukhyun Ryu, Won-Jae Lee
최하영, 류혁현, 이원재
Korean J. Met. Mater. 2017;55(1):46-52.   Published online 2017 Jan 5
DOI: https://doi.org/10.3365/KJMM.2017.55.1.46

We investigated the effects of growth duration on the morphological, structural, and photoelectrochemical properties of TiO2 nanorods grown on a TiO2-buffered fluorine-doped tin oxide (FTO) substrate using the hydrothermal method. From the study, we found that the photoelectrochemical properties were mainly dependent on the nanorod length and (002) XRD peak..... More

         Cited By 2
Kinetics of Intermetallic Compounds Growth Induced by Electromigration of Sn-0.7Cu Solder
Electromigration에 의한 Sn-0.7Cu 솔더 금속간화합물 성장 예측
Min-Hyeok Heo, Namhyun Kang, Seonghun Park, Jun-Ki Kim, Won Sik Hong
허민혁, 강남현, 박성훈, 김준기, 홍원식
Korean J. Met. Mater. 2016;54(12):908-915.   Published online 2016 Dec 5
DOI: https://doi.org/10.3365/KJMM.2016.54.12.908

The reliability of printed circuit boards (PCB) has emerged as a critical concern as the size of solder bump decreases and current density to solder bump increases by fine pitch formation. The main failure mode of solder bumps is open-circuits due to void formation as intermetallic compounds (IMC) grow, mainly..... More

         Cited By 2
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