Korean J. Met. Mater. 2023;61(2):76-83. Published online 2023 Jan 27
DOI:
https://doi.org/10.3365/KJMM.2023.61.2.76
Abstract
This article shows how fractures in the Si
3N
4 layer, which comprises the top layer of semiconductor devices encapsulated utilizing a lead-on-chip (LOC) packaging technique, are influenced by changes in the lead-frame materials and thermal-cycling test conditions. Using thermal-cycling tests, it was found that fractures in the Si 3 N 4.....
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