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Optimization of the CMP Process with Colloidal Silica Performance for Bulk AlN Single Crystal Substrate
Hyo Sang Kang, Joo Hyung Lee, Jae Hwa Park, Hee Ae Lee, Won Il Park, Seung Min Kang, Sung Chul Yi
Korean J. Met. Mater. 2019;57(9):582-588.   Published online 2019 Aug 21
DOI: https://doi.org/10.3365/KJMM.2019.57.9.582

Abstract
Chemical mechanical polishing (CMP) of bulk AlN was performed with colloidal silica slurry at pH 9 for different times. The result shows that colloidal silica slurry at pH 9, which has the relatively high surface charge of -50.7 mV is most stable, and it was selected as chemically optimum condition..... More

                        
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